| PHILIPS SEMICONDUCTORS INC | |
| DISCONTINUED W/O REPLACEMENT | |
| 8542.90.0000 | |
| 0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM | |
| 0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM | |
| 0.008 INCHES MINIMUM AND 0.100 INCHES MAXIMUM | |
| 112.0 MILLIWATTS | |
| -55.0 TO 125.0 DEG CELSIUS | |
| -65.0 TO 150.0 DEG CELSIUS | |
| HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM POWER AND MEDIUM SPEED | |
| CERAMIC AND GLASS | |
| FLAT PACK | |
| TRANSISTOR-TRANSISTOR LOGIC | |
| QUAD 2 INPUT | |
| 4 GATE, NAND | |
| M0-004-AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL | |
| SOLDER | |
| -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE | |
| 22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT | |
| FORMED LEADS | |
| 82577-932044 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). | |
| 14 FLAT LEADS |
