Inspection & Test Capabilities

Our InterCEPT certified inspectors perform inspections on all incoming and stock material using various tools and methods. The most current industry standards and counterfeit detection test methods are used to ensure the authenticity of the components provided to our customers. If required by the customer, Resion utilizes a few independent test labs for electrical testing or other more advanced counterfeit detection testing.

Visual Inspection

Our quality inspection team is equipped with the skills to detect a wide array of visual indicators including surface anomalies such as remarked or blacktopped Read More components, as well as lead conditions. High resolution photos using microscopes or cameras are taken of the components and provided to our customers in a comprehensive inspection report for every component that is shipped from our facility. Read less

NQA ESD S20.20

Each component is measured with calibrated equipment and compared to the component data sheet to ensure the part meets the manufacturers specifications. Read More All results are recorded on the Resion Inspection Report along with photographs of the critical measurements taken.

Remarking and Resurfacing

Resistance to Solvents (remarking testing) will determine if the markings have been altered. Read More Acetone, Dynasolve or 1M2P (resurfacing testing) will determine if the part has been blacktopped by a material that would cover the original surface of the component. All product tested is photographed and documented in a Resion Inspection Report.

X-Ray Fluorescence (XRF)

Our team utilizes the EDX1800B X-Ray Fluorescence Spectrometer to check for RoHs compliance Read More and to determine the elements in the exterior metal on the component. To ensure that the parts are not counterfeit, this information is compared with the manufacturer’s specification or to other parts within the same date/lot code.


X-Ray verification is performed using the Glenbrook Technology Model RTX 113HV, combined with Read More Source-Ray SB-80-250 and GTI Real Time Image workstation. Our inspectors will verify wire bonds, die layouts, as well as lead frames to validate that they conform to the Original Component Manufacturer’s data sheet.


Our Nisene J500 Jet-etch Decapsulation System is utilized to expose the components’ die using Read More nitric and sulfuric acid. This process allows our inspectors to inspect the component die markings, layout, and wire bonds using high resolution microscopes for visual inspection. These markings and layouts are then compared to the original component manufacturer’s drawings and specifications.


The purpose this test is to validate that the components are solderable to the circuit board. Read More Resion uses the solder dip and look method using the JEDEC JSTD-002 standard or customer established criteria. The acceptance criteria is that all leads shall exhibit a continuous solder coating free from defects for a minimum of 95% of the critical area of any individual lead.

Blank Verification

The Top Max Programmer will detect if components have been programmed, using specific part fixtures to Read More ensure the parts are new and unused.